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DynamicMold in harsh environments: electronic packaging for high pressure and temperature

Next-generation marking technology: matriq AG develops the intelligent DynamicMold inserts #DM-qode# for in-line and in-mold marking of injection-molded products. Harsh environments up to 2000 bar and 150 °C at heavy load cycles and high-power demand for robust miniaturized electronic packaging.

https://www.aramis.admin.ch/Grunddaten/?ProjectID=47236

Kategorie

Innosuisse

Referenznummer

46714.1 IP-ENG

Projektstart

01.07.2020

Projektende

01.01.2023

Projektdauer

2 Years 6 Months

Projektstatus

abgeschlossen

Bereich

IMES-OST

Next-generation marking technology: matriq AG develops the intelligent DynamicMold inserts #DM-qode# for in-line and in-mold marking of injection-molded products. Harsh environments up to 2000 bar and 150 °C at heavy load cycles and high-power demand for robust miniaturized electronic packaging.

https://www.aramis.admin.ch/Grunddaten/?ProjectID=47236

Personen

Prof. Dr.

Paul Zbinden

Projektverantwortlich
Zum Detail

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