close

DynamicMold in harsh environments: electronic packaging for high pressure and temperature

Next-generation marking technology: matriq AG develops the intelligent DynamicMold inserts #DM-qode# for in-line and in-mold marking of injection-molded products. Harsh environments up to 2000 bar and 150 °C at heavy load cycles and high-power demand for robust miniaturized electronic packaging.

https://www.aramis.admin.ch/Grunddaten/?ProjectID=47236

Category

Innosuisse

Reference number

46714.1 IP-ENG

Project start

01.07.2020

Project end

01.01.2023

Project duration

2 Years 6 Months

Status

abgeschlossen

Area

IMES-OST

Next-generation marking technology: matriq AG develops the intelligent DynamicMold inserts #DM-qode# for in-line and in-mold marking of injection-molded products. Harsh environments up to 2000 bar and 150 °C at heavy load cycles and high-power demand for robust miniaturized electronic packaging.

https://www.aramis.admin.ch/Grunddaten/?ProjectID=47236

Persons

Prof. Dr.

Paul Zbinden

Project manager
To Detail

Weitere Projekte dieser Förderorganisation

Weitere Projekte dieser Hochschule

north